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Manufacturing Systems Engineer
Nokia · Ottawa, Ontario · Posted 3 days ago
"Cut repair costs and build the test benches for a repair center that keeps Nokia fixed, mobile, and transport network hardware running to SLA."
Job Description The Repair Test Engineer is responsible to develop and maintain repair processes and test scripts. Works with suppliers and product lines to develop / deploy HW repair in repair centres by testing, diagnosing, repairing and re-testing faulty hardware in line with Nokia product quality standards. Ensures material repair conformity to HWS (Hardware Services) objectives and customer Service Level Agreements (SLAs). Be part of the Repair Engineering Team to address repair center support issues as necessary to keep test operations running. Work on projects to improve repair and reduce repair cost. Analyze potential to setup repair of product including identifying test benches required and associated costs and the associated cost reduction realized. Develop project specific validation process requirements and perform functional level testing as necessary to validate repair processes and conduct repair center audits. General understanding of repair center test processes including using boundary scan, flying probe, In-circuit test, electrical and optical functional test, electrical and optical system test and climatic test General understanding of Engineering Change Notices and how to implement and also understanding of system operation software, functional test software platforms, test program applications and software debug tools Operational understanding and use of electrical and optical test instrumentation, transmission analyzers, traffic generators, network analyzers, optical spectrum analyzers, wavelength and power meters, switches and attenuators to make measurements. Ability to navigate data and document repositories and manufacturing execution systems, Proligent, PDM, Agile, Sales Force, etc. …
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There are 1,617 open roles at Nokia right now. This role is one of 1,418 Systems Engineer openings and centers on Boundary Scan, Flying Probe, In-circuit Test, and Optical Test.
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