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Mechanical Engineer Student
Nokia · Ontario, CA · Posted 3 days ago
Help transition advanced optical pluggable module designs from prototype to production, covering thermal, structural, and manufacturability tradeoffs over a 4-month co-op.
Job Description
Position: Mechanical Engineer Student
Number of Position(s): 1
Duration: 4 Months
Start Date: January 4, 2027
Location: Onsite - Ottawa, Canada
Educational Recommendations: Currently enrolled in a mechanical engineering program with an accredited school in Canada.
In this role, you will collaborate with a world-class team of engineers to support the design, modeling, and testing of advanced optical technologies. This position offers a unique opportunity to balance thermal, structural, and manufacturability requirements while gaining hands-on experience in CAD design, Finite Element Analysis (FEA), thermal modeling, and New Product Introduction (NPI) processes. You will work cross-functionally across global locations to help transition innovative concepts into reliable, high-performance products.
How You Will Contribute And What You Will Learn
Support the mechanical design of optical pluggable modules.Review CAD models, detailed drawings, and conduct tolerance and stress analyses.Perform thermal and mechanical design verification testing (DVT) and assemble prototypes.Support the transition of designs to production with minimal redesign.Interface with suppliers/contract manufacturers to resolve integration issues.Author Engineering Change Orders (ECOs) and Bills of Materials (BOMs).Define and validate labeling, packaging, and regulatory compliance requirements.Partner with electrical, optical, manufacturing, and test teams to propose innovative solutions that improve product performance, cost, and reliability.Assist with root-cause analysis of field issues and support ongoing engineering efforts.
Key Skills And Experience
You're a great fit if you have:
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There are 1,617 open roles at Nokia right now. This role is one of 674 Mechanical Engineer openings and centers on Optical Transceiver Packaging, Asic Packaging, Shock And Vibration Testing, and Substrate Technologies.
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