Get roles like this, scored and matched, in your inbox.
Sign up free →Job Opening
Senior Advanced Semiconductor Packaging Engineer - 1119On-site — Full-timeUS Brooklyn Park, MN / US Malta, NY
Quantinuum · Posted today
Design packaging schemes for the highly-scaled ion traps inside Quantinuum's quantum computers, working directly with ASIC, ion trap, and optical teams on large-format chips with high I/O density.
We are seeking a Senior Advanced Semiconductor Packaging Engineer to work either at one of our Minneapolis, MN sites or at a supplier site in Malta, NY as a full-time Quantinuum employee to develop innovative and reliable packaging schemes for the highly-scaled ion traps in our quantum computers. The ideal candidate will be a mid-career engineer with a background in advanced packaging concepts. This role will work alongside ASIC designers, ion trap designers and fabricators, optical designers, and third-party vendors to prototype, design, and fabricate ion trap assemblies for our quantum computers. Candidates should expect to be immersed in a fast-paced, multi-functional, team-based challenging technical environment where an individual with talent and initiative can stand out and thrive.
Key Responsibilities:
- Develop and implement advanced packaging concepts for mechanical, thermal, electrical, optical, and detection interfaces to next-generation ion traps
- Develop packaging strategies and processes for large-format ion trap chips with high I/O signal count and density
- Work with vendors to implement and validate packaging processes
- Support all stages of ion trap development to ensure compatibility with packaging
- Interface with broader Quantinuum team to ensure ion trap packaging meets system requirements
- Engage with 3rd parties to cultivate possible key partnerships, supplier relationships, and co-development opportunities
- Bachelor’s degree minimum
- 5+ years of experience in an engineering or R&D environment
- 3+ years of experience in advanced semiconductor packaging development
- Due to Contractual requirements, must be a U.S. Person. defined as, U.S. citizen permanent resident or green card holder, workers granted asylum or refugee status
- PhD in Physics or Engineering
- 7 years of experience with advanced large-area multi-chip semiconductor packaging technologies
- 5 years of experience with large heterogeneous integration and 2.5-3D packaging techniques
- 5 years of experience with high-density I/O technologies
- Experience with photonic packaging and fiber-to-chip coupling is a plus
- A proven track record of innovation and IP development
- Experience working within a cross-functional team environment
…
This posting is sourced from Quantinuum's own career site — applying takes you there directly.
Get roles like this, scored and matched, in your inbox.
Sign up free →Related roles
There are 128 open roles at Quantinuum right now. This role centers on Advanced Semiconductor Packaging, Heterogeneous Integration, 2.5d Packaging, and 3d Packaging.
Want roles like this found for you?
Set your Focus once. Career Engine screens every new opening every week.
A scored, explained shortlist — not a keyword match — delivered weekly. Free for one profile.