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Silicon Photonics Packaging Lead (Flip Chip & Fanout)
Nokia · Québec, Quebec · Posted 3 days ago
Nokia is seeking a Packaging Development Engineer to lead the development of next-generation packaging solutions for silicon photonics and high‑speed electronics. You will own all advanced packaging activities—from flip chip to wirebonding—and oversee production readiness with cross‑functional teams.
Responsibilities include optimizing assembly, maintaining documentation and BOMs, and supporting contract manufacturers to ensure a smooth transition to mass production.
This posting is sourced from Nokia's own career site — applying takes you there directly.
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This role centers on Flip Chip, Wirebonding, Silicon Photonics, and Advanced Packaging. There are 1,617 open roles at Nokia right now.
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