Thermal & Mechanical Engineer, Annapurna Labs - AI Silicon Packaging

As a member of the Machine Learning Acceleration team you'll be responsible for the design and optimization of hardware in our data centers. You'll provide leadership in the application of new technologies to large scale server deployments in a continuous effort to deliver a world-class customer experience. This is a fast-paced, intellectually challenging position, and you'll work with thought leaders in multiple technology areas. You'll have high standards for yourself and everyone you work with, and you'll be constantly looking for ways to improve your products performance, quality and cost. We're changing an industry, and we want individuals who are ready for this challenge and want to reach beyond what is possible today.

Key job responsibilities

• Perform finite element simulations and analytical modeling to evaluate assembly, test, and reliability risks for advanced semiconductor packages
• Design and execute experiments on materials and packaging or system structures to validate performance and inform design decisions
• Develop risk evaluations for future Annapurna packages, providing data-driven recommendations that shape next-generation package designs
• Collaborate with Quality and Reliability, Package Design, Test, and System Design teams to optimize package architectures and resolve cross-functional technical challenges
• Communicate findings through clear documentation and design reviews, contributing to specifications and trade-off analyses that guide team decisions

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