Assembly Design Kit (ADK) Engineer

About SK hynix America:

At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering everything from advanced mobile technology to massive AI data centers. With major investments in the U.S. and a leading position in the global AI revolution, we build the critical infrastructure of the digital landscape and remain committed to sustainable operations. We invite innovative minds to be part of our journey. Here, you will be part of a collaborative team pioneering the next generation of memory technologies, expanding our market footprint, and defining the future of computing.

SK hynix America is seeking a highly experienced and motivated ADK (Assembly Design Kit) engineer to join our Advanced Packaging R&D team. In this critical role, you will be at the forefront of semiconductor innovation, leading the development of robust design rules and verification flows for our next-generation 2.5D/3D Interposer and Heterogeneous Integration technologies.

You will serve as the vital bridge between package architecture, process integration, and design implementation. Your primary responsibility will be defining the Design Rules, DRC (Design Rule Check), and LVS (Layout vs. Schematic) frameworks that ensure our advanced designs are manufactural, reliable, and high-yielding. The ideal candidate possesses deep expertise in Physical Verification (PV), a comprehensive understanding of semiconductor packaging processes (specifically TSV, Micro-bump, bridge die and RDL), and the strategic ability to translate complex process constraints into design rules. Furthermore, you will play a key role in optimizing the overall design-to-signoff flow, ensuring seamless integration across multidisciplinary teams.

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