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Assembly Engineer(CN Campus)
Monolithic Power Systems · Chengdu - China · Posted 1 day ago
Work across the full semiconductor chain, from wafer production and chip testing to end-use applications, while owning packaging quality and failure root-cause work with suppliers.
Job Description: 监控和提高封装厂在技术，质量，反馈，交期以及成本方面的表现； 工作比例：20% Idea + 70% Taken+10% Other. 工作中，会了解到芯片市场需求，代码设计，晶圆生产，封装测试和客户端最终应用场景，对整个半导体产业链有一个全面的认识。 岗位职责： 1、 处理封装质量事故，协助封装供应商查找原因并制定改进措施，预防同类事故再次发生； 2、 监控和分析封装良率、废品模式、SPC等以确保可靠的产品质量，查看封装供应商在线产品的状况以缩短产品封装周期，保证准时交货； 3、 处理在封装供应商处芯片来料问题及测试线因封装问题而被扣留的产品； 4、 协助FA工程师分析封装失效废品，找到失效原因并与封装供应商一起提出解决措施； 5、 协助对各种新封装供应商、封装材料、封装模式、封装流程等的评估； 6、 完成领导指派的工作。 岗位要求： 1、 全日制研究生，工科类专业；如电子工程类，微电子类相关学科； 2、 对半导体有一个初步认识，且有志从事半导体行业。
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