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Chiplet Packaging Architect — 2.5D/3D Integration
Rapidus Corporation · United States · Posted 94 days ago
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There are 20 open roles at Rapidus Corporation right now. This role centers on Semiconductor Package Design, High-speed Interfaces, and 5+ Years Experience.
See this month's Hiring Index: Fabs Are Closing. Design Isn't. for the broader trend behind roles like this one.
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