Engineer III (Diebond)

As a Development Die Bond Engineer , you will be responsible for developing, qualifying, and industrializing new die attach technologies, processes, materials, and equipment for semiconductor packaging applications. You will play a key role in bringing new products and advanced packaging solutions from concept to high-volume manufacturing. Working closely with R&D, Product Development, Process Engineering, Quality, and Operations teams, you will drive innovation and ensure robust, scalable, and cost-effective die bond solutions that meet future technology requirements.

What will you do

• Develop and qualify new die bond processes, materials, and assembly technologies.
• Lead process development activities for new semiconductor packages and products.
• Design and execute experiments (DOE) to optimize process performance and reliability.
• Evaluate and introduce new die bonding equipment, tools, and process capabilities.
• Support technology transfer from development to mass production.
• Conduct process characterization, capability studies, and reliability assessments.
• Perform root cause analysis for development-related process challenges.
• Collaborate with suppliers and equipment vendors on emerging technologies and process solutions.
• Generate technical documentation, process specifications, and qualification reports.

What will you need

• Bachelor's Degree in Electrical Engineering, Electronic Engineering, Mechatronics Engineering, Manufacturing Engineering, Materials Engineering, or a related field.
• 2-5 years of experience in semiconductor assembly, die attach/die bond process engineering, or advanced manufacturing.
• Fresh graduates with strong academic achievements and relevant industrial exposure may be considered for entry-level positions.