Global Supply Chain Manager, OSAT

Tenstorrent is building high-performance AI systems and the supply chain required to deliver them at scale. We are looking for a Global Supply Chain Manager to own OSAT partnerships, backend manufacturing execution, and supply continuity from wafer-out through final shipment.

This role is based in Toronto, Taiwan, or Austin, with regular travel to Taiwan and other Asia-based partner sites, approximately 25-30%. Candidates should be located near one of these hubs and able to work effectively across North American and Asia-Pacific time zones.

• Bring 7+ years of experience in semiconductor supply chain, manufacturing, or supplier management, along with a bachelor’s degree in Supply Chain, Engineering, or a related discipline.
• Have a strong understanding of OSAT workflows, including flip-chip, wire bond, and wafer-level packaging, with hands-on experience working with Taiwan-based OSAT partners.
• Are comfortable negotiating complex supplier agreements, pricing, tooling, or NRE costs and managing relationships across technical, commercial, and operational issues.
• Are a clear, direct, and trusted communicator who can work effectively across global teams, suppliers, and North American and Asia-Pacific time zones; Mandarin fluency is a plus.
• Are a structured, data-driven operator with experience using ERP systems such as SAP or Oracle, PLM systems, and reporting tools such as Tableau or Power BI, and you take ownership in ambiguous situations.
• Lead OSAT supplier relationships, QBRs, KPI reviews, escalations, and commercial negotiations while building trust and holding partners accountable.
• Coordinate engineering builds, qualification lots, process readiness, yield ramps, demand, capacity, materials, and production schedules across OSAT partners.
• Manage backend operations including bumping, assembly, burn-in, final test, and system-level test for advanced packaging and multi-die products.
• Own substrate and critical-material sourcing, including capacity, pricing, tooling, lead-time risk, and high-density substrate requirements for HBM and AI compute products.
• Resolve supply, quality, yield, logistics, and schedule risks while establishing reliable OSAT data, KPIs, and processes to support analytics and automation.
• How advanced AI hardware moves from wafer fabrication through packaged silicon delivery.
• How OSAT capacity, yield, quality, cost, and logistics decisions affect product availability.
• How to manage strategic partnerships with leading semiconductor manufacturers across Asia.
• How advanced packaging and multi-die products scale from qualification into volume production.

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