Intern, Thermal Modeling & Simulation Engineer (AI Memory / HBM)

• Project Overview: Every new generation of AI accelerator pushes more power through stacked memory, and temperature is now one of the limits on how fast and how dense HBM can be. Our lab builds compact thermal models that turn workload-driven power maps of a 3D-stacked HBM into transient temperature maps in minutes rather than the hours a full CFD run takes, while staying close to CFD accuracy. As an intern you will own one piece of this platform end to end: from the physics and the CFD reference to a validated model that architecture, power, and package teams use to make design decisions.
• Skills You’ll Learn:
• Heat conduction in 3D-stacked die: TSV arrays, micro-bumps, underfill, and anisotropic effective properties
• Compact and reduced-order thermal modeling
• CFD modeling and validation with Simcenter Flotherm
• Scientific computing at scale: sparse solvers, preconditioning, and fast Python/MATLAB code
• Power-thermal co-simulation and thermal-aware design of AI memory systems

Samsung’s Power & Thermal Lab is seeking a thermal engineering intern to help build and calibrate models of HBM stacks and package.

We are a small, fast ‑ moving team where direct ownership and minimal busywork empower every member to tackle the same real‑world problems. Working with authentic data, real partners, and production‑grade results, our contributions flow straight into platforms used across the company.

As an intern, the models you build feed design discussions for future HBM products. You will work on real projects with tangible results , receive mentorship, and help shape the scope of work in a collaborative environment where hardware, software, and thermal experts work side‑by‑side on next‑generation AI memory technologies.

Location: Daily onsite presence at our San Jose headquarters in alignment with our Flexible Work policy

Reports to: SVP, R&D (Power & Thermal Lab)

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