Mechanical Engineer

THE ROLE: AMD's Advanced Packaging team is developing next-generation packaging and cooling solutions that enable industry-leading AI, HPC, FPGA, ASIC, and SoC products. In this role, you will work closely with packaging architects, suppliers, and manufacturing partners to develop mechanical solutions for advanced semiconductor packages, helping drive designs from concept through production.

This is a highly collaborative position with strong exposure to advanced packaging technologies, supplier engagement, manufacturability, and future platform development.

THE PERSON: You are a hands-on mechanical engineer with semiconductor packaging experience and a strong foundation in mechanical design, modeling, and product development. You enjoy working with suppliers, reviewing designs, solving technical challenges, and helping bring new technologies into production.

You thrive in a cross-functional environment and can effectively balance technical execution, manufacturability, and product requirements.

KEY RESPONSIBILITIES:

• Support development of advanced semiconductor packaging solutions for AI, HPC, FPGA, ASIC, and SoC products.
• Drive mechanical design activities including CAD modeling, tolerance analysis, fit checks, and DFM reviews.
• Collaborate with suppliers and contract manufacturers to develop manufacturable packaging solutions and define design requirements.
• Review and evaluate mechanical designs, simulations, drawings, and engineering changes to ensure product quality and manufacturability.
• Support thermo-mechanical modeling and package integration activities using tools such as Creo and ANSYS Mechanical.
• Contribute to chip, package, board, and system-level integration efforts.
• Partner with packaging, thermal, reliability, manufacturing, and supply-chain teams throughout product development and ramp.
• Support development of next-generation packaging, cooling, and materials technologies for future AMD products.

REQUIRED QUALIFICATIONS:

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