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Package Development Engineer

onsemi · Taiwan · Posted 3 days ago

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Power Module PackagingDrMOSSmart Power StagePackage ArchitectureSubstrate DesignFlip-Chip IntegrationPassive Component AssemblyReliability Qualification

"Lead development and qualification of advanced multi-phase power module, DrMOS, and Smart Power Stage packages from architecture through manufacturing readiness."

Lead the development and qualification of advanced multi-Phase Power Module, DrMOS, and Smart Power Stage (SPS) packages. Responsible for package architecture, substrate design, flip-chip integration, passive component assembly, reliability qualification, and manufacturing readiness. Collaborate closely with Product Engineering, Silicon Design, Reliability, Operations, OSATs, and suppliers to deliver high-performance, cost-effective power packaging solutions.

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This role centers on Power Module Packaging, Drmos, Smart Power Stage, and Package Architecture. There are 715 open roles at onsemi right now.

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