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Why you fitThis role calls for Allegro X Apd and Ic Package Layout Design — tell us what you know and we'll check the rest.
Gap to noteAlso lists 3-5 Years Package Layout Experience — worth confirming before you apply.

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Package Layout Engineer

Lightmatter · Mountain View, CA · Posted 78 days ago

$157k–$176khybridic
Allegro X APDIC Package Layout DesignSignal IntegrityPower IntegrityPackage DesignSubstrate LayoutDesign for Manufacturing (DFM)Design for Assembly (DFA)

Lightmatter is looking for a Package Layout Design Engineer to drive the next generation products from concept to development. You will be part of the Signal Integrity, Power Integrity and Packaging team, tasked with delivering substrate layouts that support the package architecture from concept, through design optimization and completion, meeting stringent signal integrity, power integrity, and design for manufacturing requirements. This position offers a unique opportunity to work on new package architectures by solving complex interactions across digital, analog and photonics domains.

  • Deliver IC package substrate layouts for standard and advanced packaging technologies.
  • Contribute to the product concept phase by delivering preliminary substrate designs and floorplanning to support overall stack-up (Silicon/package/MB) optimization.
  • Collaborate with package substrate suppliers and Outsourced Semiconductor Assembly and Test (OSAT) companies to apply layout design rules, stack up, and implementation guidelines.
  • Generate fab files and coordinate with substrate suppliers and OSATs to support Design for Manufacturing (DFM) and Design for Assembly (DFA) closure.
  • Design package layouts while adhering to signal integrity, power integrity, thermal, and mechanical requirements.
  • Design packages incorporating analog and digital elements/interfaces.
  • Support signal/power integrity engineers by providing iterative test routes to refine design rules and routing topologies.
  • Coordinate across functional teams to execute error-free Package Design Tape Outs on schedule.
  • Support and adapt design automation and verification activities to improve team efficiency.
  • B.S. or M.S. degree in Electrical Engineering or similar discipline with at least 5 years of relevant experience
  • Minimum 3–5 years of experience in IC package layout design.
  • Proficient with Allegro X APD.
  • Understanding of IC package substrates and organic materials, and their impact on package design.

Preferred Qualifications

…

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There are 58 open roles at Lightmatter right now. This role centers on Allegro X Apd, Ic Package Layout Design, 3-5 Years Package Layout Experience, and Signal Integrity.

See this month's Hiring Index: Fabs Are Closing. Design Isn't. for the broader trend behind roles like this one.

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