Physics | Mechanical Engineering internship: particle bouncing model validation

Introduction Within the Wafer Defectivity team at ASML in Veldhoven, you will help improve the reliability of advanced semiconductor manufacturing systems. Dust particles can land on silicon wafers and affect the performance of computer chips. The team investigates where particles originate and develops long-term solutions to reduce particle contamination. In this internship, you will contribute to a better understanding of particle-surface interactions and help improve prediction models for particle transport and trapping.

Your assignment In this internship, you will support research on particle bouncing behavior to improve the understanding of particle-surface interactions. You will work with experimental measurement data and use your findings to validate and enhance existing physical models. The results of your work will contribute to more accurate predictions and support product improvements. Your main responsibilities will be:

• Process and analyze large experimental datasets related to particle-surface interactions.
• Identify particle-bouncing characteristics, trends, and relevant physical insights from measurement data.
• Compare experimental results with predictions from existing particle-bouncing models.
• Investigate differences between measurements and simulations and propose model improvements.
• Support experimental activities to validate models and explore interaction mechanisms.
• Summarize findings in clear reports and presentations.
• Collaborate with stakeholders to support technical discussions and decision-making.

This is a master's internship for minimum 4 months, minimum 4 days per week (3 days on-site). The start date of this internship is as of March 2027.

Your profile To be suitable for the internship, you:

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