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Senior Assembly Design Kit (ADK) Development Engineer (2.5D/3D Advanced Packaging)
Rapidus Corporation · United States · Posted 122 days ago
Overview We are seeking a highly skilled ADK (Assembly Design Kit) Development Engineer to lead the creation, integration, and validation of design enablement infrastructure for 2.5D/3D advanced packaging, including chiplet-based architectures, silicon interposers, and heterogeneous integration technologies. This role is central to enabling next‑generation multi‑die systems by delivering robust ADKs that bridge design, manufacturing, and EDA ecosystems.
You will collaborate closely with packaging R&D, process integration, EDA vendors, IP partners, and customer design teams across multiple global sites.
Locations: Albany, NY (USA) / Santa Clara, CA (USA) / Tokyo (Japan) / Chitose (Japan)
Employment Type: Full-time
Department: Design Enablement / Advanced Packaging Technology
About Rapidus
Rapidus Corporation, founded in 2022, is Japan-led initiative to build a world-class advanced logic semiconductor foundry. With a bold vision to accelerate innovation, we are pioneering cutting-edge logic semiconductor research, development, design, and manufacturing to transform the global semiconductor industry.
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This role centers on Advanced Packaging, 3dic/2.5d Packaging, Package Design, and Drc/lvs Development. There are 20 open roles at Rapidus Corporation right now.
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