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Senior Customer Package Design Integration Engineer (2.5D / 3D Packaging
Rapidus Corporation · Santa Clara, CA · Posted 99 days ago
Position: Senior Customer Package Design Integration Engineer (2.5D / 3D Packaging) We are seeking a highly capable Customer Package Design Integration Engineer (2.5D / 3D Packaging) to ensure the successful execution of customer chiplet-based product development using Rapidus advanced packaging technologies.This role serves as the primary technical and program interface between Rapidus and customers , integrating ADKs (Assembly Design Kits), packaging technologies, and customer design activities into a unified, successful outcome.You will combine deep expertise in 2.5D/3D packaging and chiplet integration with strong program management and cross-functional coordination skills to drive customer designs from bring-up through tape-out in a rapidly evolving technology environment.Locations: Albany, NY (USA) / Santa Clara, CA (USA) / Tokyo (Japan) / Chitose (Japan)Employment Type: Full-timeDepartment: Design Enablement / Advanced Packaging TechnologyAbout RapidusRapidus Corporation, founded in 2022, is Japan-led initiative to build a world-class advanced logic semiconductor foundry. With a bold vision to accelerate innovation, we are pioneering cutting-edge logic semiconductor research, development, design, and manufacturing to transform the global semiconductor industry.Why Join UsYou will play a central leadership role in building the world’s most advanced 2nm and next ‑ generation enablement ecosystem , shaping the foundation for future semiconductor innovation.You will focus on the implementation stages (Synthesis and PnR) of the digital reference flow. …
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This role centers on 2.5d/3d Packaging, High-speed Interfaces, Package Design Tools, and Chiplet Integration. There are 20 open roles at Rapidus Corporation right now.
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