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Senior Packaging Engineer (WLCSP & OSAT Operations)
Wolfspeed · Chungho, Taiwan · Posted 21 days ago
Lead WLCSP manufacturing innovation at global OSAT partners while driving yield improvement and solving complex packaging challenges across international operations.
Job Purpose The WLCSP Engineer is responsible for overseeing the development, qualification, line sustaining, and yield improvement of Wafer Level Chip Scale Packages (WLCSP) manufactured at global OSAT partners . You will act as the technical anchor and primary interface to manage subcontractor relationships, drive technical issue resolution, and lead continuous process optimization.
Key Responsibilities
- OSAT & Vendor Management: Serve as the primary manufacturing engineering interface for outsourced assembly partners. Conduct regular technical reviews, monitor line performance metrics (KPIs), and manage capacity and supplier change requests (PCNs).
- Process Engineering & NPI: Manage the transfer of new WLCSP products from development to production phase (NPI-to-production). Supervise wafer-level processing steps at the OSAT, including back-grinding, dicing, bumping (Cu Pillar / solder ball drop), and redistribution layer (RDL) formation.
- Yield & Cost Optimization: Continuous tracking and improvement of WLCSP assembly yields, tracking defect reduction programs, and managing "Safe Launch" execution for early-production ramps.
- Quality & Failure Analysis: Lead Root Cause Analysis (RCA) and 8D problem-solving methodologies for line excursions, reliability test failures, and customer RMAs.
- Line Sustaining & Statistical Control: Monitor OSAT process capabilities using Statistical Process Control (SPC) and Design of Experiments (DOE) to prevent line disruptions and ensure process stability.
Required Technical Skills & Qualifications
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This role centers on Wlcsp, Osat Management, Advanced Packaging, and Wafer-level Processing. There are 169 open roles at Wolfspeed right now.
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