Senior Staff Engineer, Thermal Simulation

We are seeking a highly experience hands-on Senior Staff Thermal Engineer to lead thermal modeling, analysis, and solution development for semiconductors and advanced packaging technologies. The ideal candidate will have a strong technical background in semiconductor packaging, advanced packaging, electronics cooling, or a related field, with demonstrated expertise in thermal simulation and analysis.

This role will work closely with Samsung customers and internal engineering customers and internal engineering teams to develop and optimize thermal solutions from early product through detailed modeling and design validation.

The successful candidate will collaborate extensively with cross functional and cross-cultural teams.

Location: Daily onsite presence at our San Jose headquarters in alignment with our Flexible Work policy with 10-20% of domestic and international travel.

Reports to: Thermal/Mechanical Simulation Manager

• Lead and perform hands-on thermal modeling and analysis for semiconductor packages, advanced packaging, and electronic systems.
• Build and analyze detailed models using ANSYS Icepak and Siemens Flotherm, including model setup, boundary conditions, solver execution and post-processing.
• Influence the architecture and/or design, materials selection, and structural integrity of the high-performance advanced packaging, and other associated components and collaterals under manufacturing, test, and usage conditions.
• Analyze simulation and measurement results to enhance product reliability.
• Support Samsung customers throughout the product development cycle, from early thermal architecture and feasibility studies to detailed modeling, optimizations, and design recommendations.
• Translate customer requirements and thermal specifications into simulation methodologies.
• Develop best known standards and methodologies and create innovative solutions for challenging semiconductor and packaging applications.
• Communicate technical findings clearly through engineering reports, presentations and customer reviews.
• Stay current with emerging technologies in advanced packaging, HBM, 2.5D/3D integrations, high power computing, and electronics cooling.
• PhD in Mechanical Engineering, Thermal/Fluids, or related Physical Science with 10+ years of Industry Experience is preferred.
• Experience in the use of CFD tools such as ANSYS Icepak, Flotherm, CELSIUS and analyzing, debugging, and proposing solutions to resolve various electronic packaging issues observed during assembly, reliability and operation. Ability to independently build models, perform analysis, troubleshoot results and develop engineering recommendations.
• Strong understanding of heat transfer, fluid mechanics, thermal management, and electronics cooling fundamentals.
• Fundamental understanding of IC chip/package architectures and thermal design constraints.
• Working experience in SiP (System in Package) thermal analysis.
• Excellent communication and collaboration skills with demonstrated ability to work effectively in cross functional and cross cultural teams.
• You’re inclusive, adapting your style to the situation and diverse global norms of our people.
• An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.
• You’re collaborative, building relationships, humbly offering support and openly welcoming approaches.
• Innovative and creative, you proactively explore new ideas and adapt quickly to change.

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