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Silicon Photonics Advanced Packaging Intern (Summer 2027)
GlobalFoundries · New York, NY · Posted 4 days ago
Help shape packaging design rules and co-design thermal, mechanical, electrical, and optical chip-package solutions for GF's Photonix electro-optical transceivers.
About GlobalFoundries GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power-efficient and high-performance solutions for high-growth markets. GF is a trusted and holistic technology partner for customers around the world. GF’s talented, global team remains focused every day on security, longevity and sustainability. For more information, visit www.gf.com.
Internship Program Overview: Our Interns & Co-ops are our entry-level talent pipeline for GF across the globe. Our goal is to provide students with a meaningful work experience that will equip them with the skills to embark on a career in the fast-paced and growing semiconductor industry after graduation. As an intern at GF, you’ll experience one-on-one mentorship, work assignments that prioritize your growth and potential, professional development opportunities, and the chance to network with executives.
Summary of Role: GlobalFoundries (GF) is seeking a summer 2027 intern to support the development of industry-leading electro-optical transceivers using GF's Photonix platform and advanced 2.5D and 3D co-packaged optics form factors. This hands-on role will contribute to thermal, mechanical, electrical, and optical chip-package co-design with a focus on module performance, reliability, packaging design, materials selection, and advanced chiplet integration requirements.
Essential Responsibilities include:
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There are 885 open roles at GlobalFoundries right now. This role centers on Silicon Photonics, Advanced Packaging, Co-packaged Optics, and Chiplets.
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