Staff Failure Analysis Engineer

Job Description: Renesas Electronics is seeking an enthusiastic, initiative-taking, and fast-learning Staff Failure Analysis Engineer to join our team in Palm Bay, Florida. In this role, you will play a critical part in product quality, yield improvement, and customer satisfaction by conducting in-depth root cause analysis on a wide variety of semiconductor products.You will work closely with cross-functional teams—including Design, Product Engineering, Quality Assurance, and Foundry Operations—applying advanced analytical techniques and bench characterization to isolate, identify, and report on failure mechanisms.

Qualifications: Experience & Education:Bachelor’s degree in Electrical Engineering, Materials Science, Physics, Microelectronics, or a related field with a minimum of 8 years of related experience;Or a Master’s degree with 6 years of related experience;Or a PhD with 3 years of related experience;Fabrication & Packaging Knowledge: Strong fundamental understanding of front-end semiconductor fabrication processes (CMOS, BCD, or analog/mixed-signal) and modern IC packaging technologies.Bench & Test Competency: Demonstrated proficiency in using standard bench test equipment (oscilloscopes, SMUs, power supplies, multimeters) to power up devices and characterize electrical fault symptoms.Schematic & Layout Literacy: Proven ability to read and interpret electrical circuit schematics, netlists, and physical layouts (e.g., Cadence Virtuoso, GDS viewers) to trace electrical paths to physical silicon coordinates.Analytical Techniques & Instrumentation: Direct hands-on experience across traditional failure analysis workflows:Package & Non-Destructive: Curve tracing, X-ray, and Scanning Acoustic Microscopy (SAM).Image-Based Fault Isolation: Photon Emission Microscopy (PEM/EMMI), OBIRCh, and thermal emission.Deprocessing Techniques: Wet chemistry/decap, mechanical polishing/lapping, and plasma etching.

…