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Thermal Mechanical Engineer (Datacenter Platform)

AMD · Taipei, Taiwan · Posted 7 days ago

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Thermal ManagementHeat TransferFluid DynamicsCFDIcepakFlothermSolidWorksCreo

Drive thermal and mechanical readiness for AMD data center products, taking server and rack-level cooling solutions from conceptualization through mass production with ODM and customer partners.

THERMAL MECHANICAL ENGINEER

THE ROLE: As a Thermal/Mechanical Engineer in the ODM Enablement, Data Center Platform Engineering (DPEG), you will be responsible to work with ODM/OEM/Customer for the thermal Mechanical System readiness, development and validation for the AMD Data Center products in this expanding and strategic market. To accomplish this, you will need to interact with other key engineering teams such as silicon design, Platform development, board designer, validation, and manufacturing within AMD.

THE PERSON:

  • Team player, and self-starter, who possesses critical problem solving and troubleshooting skills.
  • Excellent communication skills, planning skills, and technical expertise.
  • Market savvy and comfortable in a fast-paced, multi-tasking environment.

KEY RESPONSIBILITIES: Thermal Mechanical Engineer will be responsible to work with ODM/OEM/Customer for the end-to-end development, readiness and delivery of thermal and/or mechanical solutions for Data Center Server/Rack level with associated platforms. The successful candidate will have a thermal and mechanical development background with system level experience in Data Center. They will integrate and deploy into a customer global development team in delivering commercially viable products to the marketplace in a timely manner.

Some of the key responsibilities will include

…

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This role is one of 674 Mechanical Engineer openings and centers on Heat Transfer, Fluid Dynamics, Liquid Cooling, and Solidworks. There are 1,335 open roles at AMD right now.

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